In the last issue of "CSP Watch", Xiaobian launched the CSP's most interesting topic list, and the CSP product roadmap ranked first.
The generation of CSP package is one of the inevitable trends of semiconductor packaging, and has potential advantages in market segmentation, but whether it can become the mainstream of LED future development remains to be discussed.
Package niche market
At present, LED mainstream packaging methods include PLCC type TOP LED, planar Molding plastic high power LED and COB package.
“When the roadmap is developed into the CSP LED package, this is due to the upgrade and change of the LED package structure to solve the problem of the light-receiving angle, reliability, brightness and mechanism strength of the traditional LED package.†Chen Zhengquan, general manager of New Century Optoelectronics, mentioned.
"In fact, flip chip, CSP is becoming the two hotspots of the current LED packaging industry. These two technologies are not parallel packaging technologies, but cross and integration." Dr. Li Cheng, deputy general manager of Guoxing Optoelectronics, said.
The flip chip represents the mounting method of the chip electrode, and the CSP represents the size of the package relative to the chip. Li Cheng mentioned, "At present, the flip chip technology has a place in the middle and high power. CSP also relies mainly on flip chip technology. The flip chip CSP will have certain advantages and scale in the high power market in the future."
To this end, Guoxing Optoelectronics has also pioneered the 'new composite electrode flip chip and thin film substrate CSP package', which combines the reliability of traditional ceramic packaging and the advantages of CSP miniaturization, opening up new research and development for CSP packaging technology. direction.
In addition, 2016 CSP packaging companies need to work hard to improve the efficiency of the machine. “After the CSP mass production application, the price should not be a problem. It is the key to improve the yield through technical improvement, and at present it can theoretically achieve a lower price than SMD.†Zhao Yutao, chairman of Hyun Shuo Optoelectronics mentioned .
What areas will CSP affect?
Since last year, Dr. Xiao Guowei, President of Jingke Electronics, has expressed his confidence in the application of CSP to the backlight and general lighting market on many occasions.
“Over the past 2015, CSP has emerged in the BLU backlight market, and its supporting lens resources are getting closer to maturity. CSP is expected to be the perfect solution for direct-lit backlights.†Xiao Guowei mentioned.
At the same time, Xiao Guowei also boldly predicted that CSP will be no longer a luxury in the general lighting market in 2016.
"It is true that CSP is currently a trend in TFT backlight applications. CSP packaging products are not intended to replace the existing LED packaging, but to give the industry the opportunity to move toward different industry trends." Chen Zhengquan said.
In fact, CSP packaging is not to replace the LED packaging factory, but has deeper cooperation with LED packaging factories and terminal application manufacturers. Each of them has a separate division of labor, and finds the appropriate niche market through the product structure of CSP. To maximize the synergy in this regard.
“CSP LED products are used in the traditional backlight and lighting market. Although they will compete with the original product price, in the special lighting and automotive lighting market, customers have higher design flexibility.†Xiao Guowei mentioned.
For example, special commercial lighting, patio lights, projection lights, flashlights, mobile phone flash and other projection products require optical design, so the use of CSP LED products can achieve the light-receiving function, the luminous flux per unit area (lm / mm) can achieve the best use.
Moreover, in recent years, as the gross profit margin of the chip industry continues to decline sharply, prices will continue to decline next year, which will also bring "a chance" for the development of CSP products.
“Especially when using CSP package, because the cost of the BOM accounted for more than 80% of the chip, the price advantage of CSP in the future is particularly obvious, and it will become the technical direction for upstream enterprises to provide more competitive light sources for downstream customers. Chen Zhengquan said.
There are different type bulbs of parts inside the package. For example, there are one H4 for headlight, one S25 singe filament for signal light, one dual filament S25 for stop light, one G18.5 for truck light or license plate light, one T10 for interior light or side indicators light and two different types of fuses that can replace the burned fuse. The customers will review what specs their own vehicle have and choose which to buy. Having a spare lamp in the car is like buy a insurance, because every light on the car has its specific purpose, which means any broken bulb might put the driver and others in a very dangerous situation. Highly recommend have one kits in the car.
Auto Assorted Lamp Kits
Auto Assorted Lamp Kits,Markcars Car Accessory Kit,Auto Lamp Headlight,Auto Xenon Lamp
SHINING BLICK ENTERPRISES CO., LTD. (Heshan Jianhao Lighting Industrial Co., Ltd.) , https://www.sunclubtw.com