For pseudo white LED modules with blue LED elements and yellow phosphors, IDEC has developed a new manufacturing process that can achieve stable quality and simplify processes. The resin sheet is coated on the LED element and heated to encapsulate the LED element. Compared with the original manufacturing method of encapsulating by pouring liquid resin, the time required for the encapsulation process can be reduced to 1/9.
The manufacturing method of pouring liquid resin to encapsulate first forms a “dam†around the LED element on the substrate to block the outflow of resin, then stirs the resin and phosphor, casts onto the substrate, and finally undergoes heat curing treatment. In this manufacturing method, there are many problems such as inhomogeneous mixing of the resin and the phosphor, precipitation of the phosphor in the resin, and varying amounts of the resin casting amount, which may cause unstable quality, making it difficult to maintain quality. If the quality of the packaging process is uneven, chromaticity deviation will occur.
White LED module with new manufacturing method. The LED element is encapsulated by heating the gel-like silicone resin sheet containing the yellow phosphor on the blue LED element. 
A gel-like silicone resin sheet containing yellow phosphors. Silicone resins generally cannot maintain the gel state, this time by improving the molecular structure to maintain the gel state.
The new manufacturing method is to cover the gel-like resin sheet on the LED element and heat it to about 150 ° C. After 40 minutes, the sheet hardens to complete the packaging. In the past, the method of encapsulation by pouring liquid resin required 6 hours to complete the entire encapsulation process (from dam formation to thermal curing). In the new manufacturing method, since the sheet is in the form of a gel, the phosphor will not precipitate, and the quality unevenness in the packaging process is greatly reduced. And production equipment is also expected to be greatly simplified.
The gel-like resin sheet was developed by Nitto Denko. Nitto Denko is also selling this sheet to other companies besides Edek. Using this sheet, Edek established a new manufacturing method and trial-produced a white LED module. Edek has concentrated the production of white LED modules for lighting in the Hamamatsu plant, and plans to replace all modules with new manufacturing methods in FY2013.
Embedded industrial flat panel display, optional 10.4 "to 19" LCD screens, 50,000 hours long-life LED backlight, support for multiple signal input interfaces, including VGA and Video, special requirements can increase DVI and HMI interfaces; front Panel OSD keys and USB interface are convenient for control and maintenance; support DC 12V power input, special requirements support DC 9 ~ 36V wide voltage input; suitable for harsh work in industrial fields such as factory automation, machinery manufacturing, numerical control equipment, textiles, communication, and power surroundings.
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