The role of sensors and sensor hubs in wearable devices and even IoT applications is becoming more and more important. The accuracy of MEMS sensors determines the quality of the information collected, while the sensor hub extracts information to exploit different applications. The essential.
According to Finkbeiner of Bosch Sensortec, the sensor center is now divided into three camps; in the higher-end scenarios, for example, ST is using its microcontroller to provide a more sophisticated solution, and in the part of the entry-level solution, Invensense is The sensor hub uses a state machine. As for Bosch Sensortec, it is defined between the two.
Below are the latest 6-axis MEMS sensor solutions from ST, Bosch, and Invensense.
STMicroelectronics LSM6DSL and LSM6DSM
ST introduced a new generation of highly-improved 6-axis MEMS inertial sensor modules (note: integrating a 3-axis accelerometer and a 3-axis gyroscope in one module). The LSM6DSL and LSM6DSM incorporate innovative power management features, enhanced gyroscope design and efficient data-batch processing to reduce power consumption by up to 50% over existing market-leading LSM6DS3 and LSM6DS3H. Compatible with the most popular and innovative operating system on the market, the new product demonstrates that developers maximize the user-friendly settings and energy-saving features of mainstream mobile platforms.
In addition, the new generation of sensors also improves gyroscope detection accuracy, enabling users to experience better applications such as camera anti-shake system (OIS), visual positioning detection and gesture recognition, while the new product also integrates accelerometer-driven Step detection, step count and pedometer, as well as tilt and large motion detection, simplify the work of mobile and application developers.
Among the two new products, the LSM6DSM adds a dedicated processing circuit and serial interface for the camera anti-shake system to reduce the gyro noise by 40%. With the configurable filter, the camera anti-shake performance is higher than the existing product (LSM6DS3H). Compared to solutions using stand-alone OIS sensors, the LSM6DSM not only saves component count and board space, but also consumes less than one-sixth of the competition.
The new product will be available in the second quarter of 2016 in a 14-pin LGA package with pin and package sizes compatible with the LSM6DS3/H.
Main technical features:
3-Axis MEMS Accelerometer: Full Scale ±2/±4/±8/±16 g 3-Axis MEMS Gyroscope: Full Scale ±125/±245/±500/±1000/±2000 dps Operating Current: 0.4 mA (Module Normal operation mode); 0.65mA (module high performance mode) 2.5mm x 3.0mm x 0.83mm LGA-14 package analog power supply voltage range: 1.71V to 3.6V; intelligent FIFO memory with batch data acquisition function, maximum storage capacity 4KB Magnetic sensor can correct hard/soft ironDistribution Box
Distribution Box
Wenzhou Korlen Electric Appliances Co., Ltd. , https://www.korlenelectric.com