21ic Power Integrations has announced the HiperPFS-2 product family - a new high-efficiency, power factor correction (PFC) IC family of devices for 100 W to 380 W applications. The HiperPFS-2 IC integrates a boost PFC controller, driver, PFC MOSFET, PFC diode, and various protection circuits in the same package for a particularly compact design, including small vertical PCs, all-in-ones, and gaming consoles. Small size power supply for use in adapters and televisions.
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The HiperPFS-2 controller uses a variable frequency CCM algorithm that provides up to 97% efficiency and 20% load point power over a load range of 20% to 100% for a design above 200 W at 265 VAC input. The factor is greater than 0.9. The new device includes detection components for the connection line, which has a no-load power consumption of only 60 mW for a typical high-power adapter with a no-load budget of 300 mW. Conducted and radiated EMI have been at a minimum due to the integration of soft recovery diodes and short parasitic inductance loops (due to a highly integrated, compact design).
Edward Ong, Product Marketing Manager, Power Integrations, said: "The HiperPFS-2 device is the most integrated PFC solution on the market today. It enables designers to meet the 80 PLUS® Gold and Low Cost in a space-constrained PC. Platinum-class efficiency standards. The new devices also offer excellent no-load performance, simplifying design and reducing costs in high-power adapter applications where standby or no-load specifications are critical."
The main applications of the HiperPFS-2 IC include TVs, PCs, game console adapters, telecom equipment, and industrial products including fans, motor drives and chargers. In addition, we have introduced a new reference design DER-294 based on the HiperPFS-2 IC, which introduces a 350 W output power, boost CCM PFC board with a wide range of AC inputs. The DER-294 achieves >97% efficiency over a wide load range at 230 VAC and a power factor (PF) > 0.9 at 20% load point.
Samples are now available for HiperPFS-2 devices in Power Integrations' innovative eSIP-16 package: standard eSIP16-D (H package) and L-bend eSIP16-G (L package) for ultra-thin power supply designs. Both packages feature an isolated metal heat sink pad for quick and easy installation. The HiperPFS-2 family of devices is priced at $0.959 per unit based on 10,000-piece quantities.
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