Since the heat dissipation speed of the glass fiber multilayer circuit board during the desoldering operation is very high, it is difficult to perform the desoldering operation under the amateur condition: this paper introduces a fast non-destructive desoldering glass fiber without professional tools. A variety of methods for large-scale Ic, components, slots, and sockets on a multi-layer circuit board.
First, all tools:
Honeycomb coal, high temperature adhesive tape, soldering table temperature control soldering iron, washing water, medical needle.
Second, take the desoldering computer motherboard BIOS block as an example:
1. Use high-temperature adhesive tape around the front of the BIOS holder (ie, the back of the motherboard) to protect it, leaving only the front of the BIOS holder. The medical needle is mounted on a disposable chopstick.
2. Ignite the honeycomb coal, and when it is burning, it will be pinched from the furnace and placed on the ground for a minute or two. You must wait for the flame to drop before you can proceed to the next step.
3. Place the front and back of the BIOS board on the back of the honeycomb coal center 3 to 5 cm, and continue to move the board evenly.
4. Wait 30 seconds for the solder on the board to melt, use the needle to gently pick out the BIOS holder, and after the tin plate of the BIOS pad of the main board, clean the motherboard with the washing water to complete the desoldering.
The method of installing the new BIOS holder: heating the main board, the solder on the pad on the board is melted, and the new BIOS holder pins that have been treated with antimony tin are aligned and pasted for 5 seconds to complete the mounting.
note. In the above desoldering operation, the circuit board must be kept above the honeycomb coal to prevent the circuit board from cooling down. After the desoldering is completed, the board can be cooled by washing water.
This method is extremely effective for re-soldering glass fiber multi-circuit boards. When soldering large-scale ICs, it is better to use a soldering iron to solder the pins. This method can also deal with the false soldering of the BGA chip, but it is necessary to first inject the pine perfume into the BGA pin and then heat it. This method of repairing BGA false welding has certain risks. Care must be taken.
In particular, the desoldering method described in this article is only applicable to glass fiber multilayer boards because of its excellent high mechanical strength, high heat dissipation and high temperature resistance. Ordinary single-bake bakelite circuit boards are not resistant to high temperatures, and this method is liable to cause serious damage such as deformation, blistering, burnout, etc. of the board. For thinner double-sided fiberglass panels, pay attention to the heating time when using this method to prevent deformation of the board due to excessive temperature.
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