Vincent Roche, the president and CEO of Analog Devices, highlighted heterogeneous manufacturing as a crucial direction for the future of the semiconductor industry in his 2018 Technology Trends article titled *"These Innovations Will Affect Our Life in 2018."* He pointed out that with the rising costs of deep submicron technology and the increasing challenges faced by Moore’s Law, the integration of multiple technologies within a single package, layer, or even silicon substrate is becoming more prevalent. This shift will give rise to new business models that enable smaller semiconductor manufacturers—those unable to afford the latest IC lithography equipment—to innovate and restructure. For larger suppliers, integrating signal processing algorithms onto chips can significantly enhance the value of their solutions.
Heterogeneous integration starts with the application of two patented technologies. ADI's leadership has always been optimistic about this approach, particularly through its proprietary iCoupler magnetic isolation technology. According to Wikipedia, the core of this technology involves a planar transformer that transmits signals across an isolated barrier. These transformers are fully integrated using standard semiconductor processes, consisting of two coils separated by a polyimide layer acting as an insulating barrier.
This digital isolation technology overcomes the limitations of optocouplers, such as low speed, high power consumption, and performance degradation over time. ADI also applied this chip-level transformer technology to its isoPower® isolated power supply, which combines DC-DC conversion and data isolation in one package. This eliminates the cost, size, power, and reliability issues associated with traditional optocouplers, making it easier for engineers to implement isolation in their designs. As of now, over one billion isolation channels using iCoupler technology are in use globally.
[Image: 4-channel iCoupler isolator block diagram (ADuM140x)]
In addition to iCoupler, ADI has long been involved in microelectromechanical systems (MEMS) technology, which has become a mainstream solution for sensors and actuators. MEMS integrates micro-sensors, micro-actuators, micro-mechanical structures, and signal processing circuits using advanced semiconductor manufacturing techniques. It represents one of the most complex forms of heterogeneous manufacturing.
ADI has a rich history in MEMS. In 1991, it launched the world's first commercial MEMS accelerometer, the ADXL50. Then, in 2002, it introduced the first integrated MEMS gyroscope, the ADXRS150. Today, ADI offers a wide range of high-performance MEMS products, with over one billion inertial sensors used in automotive, industrial, and consumer electronics applications.
[Image: Size comparison of ADI Lead Frame Chip Scale Package MEMS Switch (Quad Switch) and Typical Electromechanical RF Relay (Quad Switch)]
Heterogeneous manufacturing has enabled ADI to push forward in the next technological revolution. In late 2016, ADI introduced the RF MEMS switch, including the ADGM1304 and ADGM1004, marking the first commercial availability of MEMS switching technology. These switches offer RF performance from 0 Hz (DC) up to 14 GHz, utilizing electrostatically actuated switches in sealed silicon capacitors. The low-voltage driver ICs improve performance, reduce size by 95%, increase speed by 30 times, boost reliability tenfold, and cut power consumption to just 10% of traditional options.
[Image: Schematic diagram of RF MEMS switch ADGM1304]
A breakthrough in switching technology, heterogeneous integration has led to significant advancements. Traditional electromechanical relays have been used for over a century but suffer from limitations like narrow bandwidth, limited lifespan, and large size. MEMS switches were seen as a promising alternative, offering small size, high performance, and minimal signal loss. However, mass production and reliability remained major hurdles.
[Image: ADI: The topic of heterogeneous manufacturing as an important perspective for the future development of the industry]
ADI invested heavily in developing a gold cantilever beam structure for its MEMS switches. By changing the contact material from gold to a hard alloy, the company improved the switch’s longevity. Each cantilever beam is electrostatically actuated, pulling down under a low voltage to make contact. The on-resistance of each contact is only 5 ohms, resulting in very low overall resistance and the ability to transmit power up to 36 dBm. The tiny movement of just 0.3 microns, combined with ADI’s sealing technology, ensures high reliability—a key factor in mechanical design.
As a new model for heterogeneous integration, ADI’s RF MEMS switches achieve superior performance and compact size. The ADGM1304 and ADGM1004 offer best-in-class performance from DC to Ka-band, with cycle life orders of magnitude higher than traditional relays. They also provide excellent linearity and ultra-low power consumption, addressing key challenges in MEMS commercialization. This helps engineers develop faster, smaller, more energy-efficient, and reliable products.
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