Vincent Roche, the president and CEO of Analog Devices, highlighted the importance of heterogeneous manufacturing as a key trend for the future of the semiconductor industry in his 2018 Technology Trends article titled "These Innovations Will Affect Our Life in 2018." He emphasized that as the costs of deep submicron technology continue to rise and Moore's Law faces growing technical and financial challenges, the integration of multiple technologies within a single package, layer, or even silicon substrate will become increasingly common. This shift is expected to drive new business models that enable smaller semiconductor manufacturers—those unable to afford cutting-edge lithography tools—to innovate and restructure. For larger suppliers, integrating signal processing algorithms directly onto chips can significantly enhance the value of their solutions.
Heterogeneous integration begins with the application of two patented technologies. ADI’s leadership has always been enthusiastic about this approach, particularly its proprietary iCoupler magnetic isolation technology. According to Wikipedia, the core of iCoupler technology is a planar transformer that transmits signals across an isolated barrier. These transformers are fully integrated using standard semiconductor processes, with two coils separated by a polyimide layer acting as the insulation. This digital isolation solution overcomes the limitations of traditional optocouplers, such as low speed, high power consumption, and performance degradation over time. ADI also applies this chip-level transformer technology to its isoPower® isolated power supply, which combines DC-DC conversion and data isolation in a single package. This innovation allows engineers to bypass the cost, size, power, and reliability limitations of optocouplers, making isolation design more efficient. To date, over one billion isolation channels using iCoupler technology are in use worldwide.
The 4-channel iCoupler isolator block diagram (ADuM140x) illustrates how this technology works at the system level. Beyond iCoupler, another significant area where heterogeneous manufacturing plays a critical role is microelectromechanical systems (MEMS). MEMS have become the mainstream technology for sensors and actuators over decades. Built on microelectronics, they combine advanced electronic and mechanical components through techniques like lithography, etching, thin films, LIGA, and precision machining. These devices integrate micro-sensors, micro-actuators, micro-mechanical structures, signal processing circuits, and more into a single system, representing a prime example of heterogeneous manufacturing.
ADI has a long history in MEMS technology. The world’s first commercially successful MEMS accelerometer, the ADXL50, was developed and launched by Analog Devices in 1991. In 2002, ADI introduced the first integrated MEMS gyroscope, the ADXRS150. Today, the company offers a wide range of high-performance MEMS products, having shipped over one billion inertial sensors for automotive, industrial, and consumer electronics applications.
A comparison between ADI’s lead frame chip scale package MEMS switch (Quad Switch) and a typical electromechanical RF relay highlights the advantages of MEMS in terms of size and performance. In late 2016, ADI introduced its RF MEMS switch products, including the ADGM1304 and ADGM1004, marking the first commercial deployment of MEMS switching technology. These switches offer DC to 14 GHz performance, utilizing electrostatically actuated switches in sealed silicon capacitors. This design reduces size by 95%, increases speed by 30 times, improves reliability tenfold, and cuts power consumption to just 10% of traditional relays.
The schematic diagram of the RF MEMS switch ADGM1304 demonstrates the internal structure and functionality of the device. Traditional electromechanical relays have been used in the electronics industry for over a century, but they suffer from various limitations, including narrow bandwidth, limited lifespan, and large form factors. MEMS switches, on the other hand, offer a promising alternative with compact size, high reliability, and the ability to handle signals from DC up to hundreds of GHz with minimal loss. However, despite their potential, many companies have struggled to bring reliable MEMS switches to market at scale.
ADI has invested heavily in developing a gold cantilever beam structure for its MEMS switches. By replacing gold-to-gold contact designs with hard alloy metals, the company significantly improved the switch’s lifespan. Each cantilever is electrostatically actuated, and when activated, it pulls down to create a low-resistance path. The small movement of only 0.3 microns, combined with ADI’s patented sealing technology, ensures high reliability—a crucial factor in mechanical design.
As a new model for heterogeneous integration, ADI’s RF MEMS switches have achieved remarkable improvements in performance and miniaturization. The ADGM1304 and ADGM1004 deliver industry-leading performance from DC to Ka-band and beyond, with cycle life orders of magnitude higher than traditional relays. Their excellent linearity and ultra-low power requirements make them ideal for next-generation systems, helping engineers develop faster, smaller, more energy-efficient, and reliable products.
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