As everyone knows, the current LED chip is roughly divided into three kinds of structures, the first one is a positive-loaded chip, the second is a vertical chip, and the third is a flip-chip-FC-LED, and currently the majority of the positive-loading chips.
The majority of dresses have a large share and do not affect the development of flip-chips. Although the market share of flip-chips has not yet occupied a large market, its structure does exist. There are ceramic substrates, single packages, integrated packages and CSPs. Among them, the bracket flip is one of the structures of the flip chip package.
The appearance of the bracket flip is actually related to the dress chip. Because the previous dress is a bracket type, and the related equipment of the industrial chain is also compatible with it. Based on this background, there will be today's concept of scaffolding. That is, flip chip + with cup cavity bracket, and FEMC refers to "Filp-chip + EMC bracket", which is a package product combining flip chip and EMC bracket, which is one of the bracket type packages.
Ruifeng's current stent-type flip-chip is mainly based on EMC brackets, regardless of thermal resistance, junction temperature, voltage, saturation current, and thermal steady-state lumens. Compared with ordinary SMD, ceramic FC, COB FC, CSP. Big advantage.
The significance of the existence of scaffolding
From the perspective of LED packaging market capacity, ceramic and COB packages account for about 3% of LED package devices, EMC accounts for 20%, and PLCC accounts for about 75%. It can be seen that the current bracket package accounts for most of the LED package, and in the bracket package. Importing flip-chips will revolutionize traditional packaging. According to LEDinside data, the compound annual growth rate of flip-chips from 1999 to 2017 reached 99%, while the application of flip-chips has nearly tripled.
From a technical point of view, the biggest difference between the bracket package and the CSP, ceramic package, and COB package is that the bracket package is not a simple two-dimensional planar package.
From the perspective of reliability and device matching, because of the advantages of flip chip, the saturation current of the bracket flip-chip is larger, the current is higher, and the reliability of the product is better. At the same time, it can meet the relatively common level of patch technology, while the CSP package has many advantages, but in the patch, the equipment requirements are relatively high. Therefore, the bracket type package is more convenient in application than the protection.
From the perspective of the solid crystal material, the thermal conductivity of the entire solder paste of the package of the flip-chip is higher than that of the insulating rubber compared to the formal EMC package, which is a very good guarantee for the reliability of the whole product.
From the point of view of light efficiency, although the flip-chip light-emitting efficiency is currently not comparable to that of a positive-loaded chip, it has a very good single-lamp transmittance because it has a low voltage. . So overall, if you don't consider too many light effects, using flip-chip products can reduce the cost of the integrated light source. Especially in TV backlight applications, because the glass transmittance is getting lower and lower, the requirements for LED light efficiency are not so high, so basically can be seamlessly cut.
Bracket flip-chip FEMC packaging process
The stent-type flip-chip LED packaging process is simply a process of printing the solder paste onto the holder by 3D printing technology, and then implementing the packaging process by reflow soldering and potting.
However, in actual operation, there are several major problems. The first is the problem of secondary reflow; the second is the void rate; the last is the leakage lamp. In the past year or so, Ruifeng has completely overcome these problems.
For traditional packaging, if the bracket flip can go on, it will be a big change for the entire LED industry, especially the packaging industry.
KNLN6-63 TWO FUNCTION : MCB AND RCCB FUNCTIONS
leakage breaker is suitable for the leakage protection of the line of AC 50/60Hz, rated voltage single phase 240V, rated current up to 63A. When there is human electricity shock or if the leakage current of the line exceeds the prescribed value, it will automatically cut off the power within 0.1s to protect human safety and prevent the accident due to the current leakage.
leakage breaker can protect against overload and short-circuit. It can be used to protect the line from being overloaded and short-circuited as wellas infrequent changeover of the line in normal situation. It complies with standard of IEC/EN61009-1 and GB16917.1.
KNLN6-63 Residual Current Circuit Breaker With Over Load Protection
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