In the past year, GE Lighting has installed 70W PAR30 ceramic metal halide lamps and magnetic ballast systems for 500 Anta stores. The new lighting makes the product display more attractive and more obvious, increasing sales opportunities and creating a superior shopping atmosphere. The new lighting solution replaces the tungsten halogen lamps used in the storefront with GE PAR30 ceramic metal halide lamps. The new GE lighting solution is estimated to save energy and maintenance costs of approximately RMB 10.22 million per year.
The GE HID Lamp Inductance Ballast Series is tested with the TW130 and can be used with GE CMH sources. The ballast is compact and easy to install, with long life and high reliability. The product is equipped with thermal protection to prevent overheating of the ballast and potential safety hazards due to the rectification effect at the end of the lamp. GE's star product CMH light source and HID lamp magnetic ballast are ideal for HID light source electrical systems.
GE PAR30 ceramic metal halide lamps are characterized by high luminous efficiency, long life and good color consistency. Unique three-part ceramic arc tube design for longer life and reliability, with a rated life expectancy of up to 13,000 hours and a color rendering index (CRI) of up to 89, compatible with standard metal halide ballasts Used, widely used in commercial retail lighting, office lighting, architectural flood lighting, urban beautification and hotel lighting.
HDI PCB Specification
High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design is able to incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.
HDI PCBs are characterized by high-density attributes including laser microvias, fine lines and high performance thin materials. This increased density enables more functions per unit area. Higher technology HDI PCBs have multiple layers of copper filled stacked microvias (Advanced HDI PCBs) which creates a structure that enables even more complex interconnections. These very complex structures provide the necessary routing solutions for today's large pin-count chips utilized in mobile devices and other high technology products.
The HDI PCBs we offer include the following highly requested characteristics:
Blind and/or buried vias
Through vias from surface to surface
20 Âµm circuit geometries
30 Âµm dielectric layers
50 Âµm laser vias
125 Âµm bump pitch processing
HDI PCB is used to reduce size and weight, as well as to enhance electrical performance of the device. HDI PCB is the best alternative to high layer-count and expensive standard laminate or sequentially laminated boards. HDI incorporate blind and buried vias that help to save PCB real estate by allowing features and lines to be designed above or below them without making a connection. Many of today's fine pitch BGA and flip-chip component footprints do not allow for running traces between the BGA pads. Blind and buried vias will only connect layers requiring connections in that area.
HDI PCB,Special HDI PCB,HDI Prototype PCB,HDI Board PCB
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